In order to improve how OEMs develop intelligent, connected devices in the AI-Led Product Era, MosChip Technologies announced that it will introduce its new ProductXcelerate Blueprints at Embedded World North America. Attendees will witness ProductXcelerate Blueprints in action at MosChip Booth [#4068].
One can reserve their slot by clicking here to experience an exclusive demonstration.
Integration issues with hardware, software, and digital and AI lifecycles continue to arise as OEMs speed up the development of intelligent products.
These obstacles are said to be addressed by MosChip’s Integrated Engineering methodology, which unifies digital, AI, embedded software, and hardware engineering design under a single, co-engineered lifecycle.
Key Highlights
- Integrated by Design: Unified hardware, software, digital, and AI lifecycle for next-gen product development
- Pre-Validated & Vertical-Ready: SMARC-class modular design built for compliance and reuse
- AI-Infused Architecture: DigitalSky GenAIoT for connectivity and intelligence; AgenticSky™ for adaptiveness and autonomy
- Lifecycle-Continuous: OTA updates, traceability, and proactive optimization built in
ProductXcelerate Blueprints are pre-validated, SMARC-aligned, vertical-ready reference designs that unify validated hardware platforms, embedded software stacks, MosChip DigitalSky GenAIoT modules, and AgenticSky™ cores – built to meet compliance, interoperability, and scalability requirements, enabling OEMs to design once, certify once, and scale confidently across product lines.
MosChip DigitalSky GenAIoT delivers connectivity and intelligence through edge-cloud orchestration, analytics, and intelligent automation, while AgenticSky cores (VisionCore, HMICore, WearableCore, ControllerCore) introduce Agentic AI traits – goal-orientation, adaptiveness, and autonomy – allowing machines, devices, and edge systems to sense, decide, and act predictably in the field.
Together, they define a seamless path from hardware to agentic AI, helping engineering teams accelerate development, simplify validation, and ensure long-term reliability.
These blueprints are designed to help OEMs cut integration cycles, reduce compliance risk, and accelerate product releases across generations.
Live Demonstrations at Embedded World North America:
MosChip will showcase ProductXcelerate Blueprints that demonstrate how pre-validated, integrated frameworks accelerate OEM innovation:
- Automotive SDV Gateway Blueprint – Built on an automotive-grade, high-performance gateway platform aligned with SOAFEE and COVESA standards; integrates DigitalSky GenAIoT telemetry orchestration and AgenticSky ControllerCore for adaptive diagnostics
- Industrial & BMS Edge Gateway Blueprint – Powered by a multi-core industrial processor with IO-Link and BACnet connectivity; integrates DigitalSky GenAIoT edge-to-cloud orchestration with AgenticSky ControllerCore for self-healing control and real-time optimization of energy and factory systems.
- Retail Auto-Checkout Kiosk Blueprint – Built on a high-performance, vision-optimized hardware platform with multi-sensor interfaces; integrates DigitalSky GenAIoT IoT & Cognitive modules and AgenticSky VisionCore + HMICore to enable autonomous, transparent, and context-aware checkout experiences at the edge.
- Home Automation Bridge Blueprint – Developed on a low-power, multi-protocol controller with Matter-ready firmware stack; features DigitalSky GenAIoT lifecycle automation and AgenticSky ControllerCore adaptive mesh recovery for resilient, intelligent home environments.
- Wearable Companion Blueprint – Designed on an energy-efficient SoC optimized for Android-class wearables; integrates DigitalSky GenAIoT health analytics with AgenticSky WearableCore for proactive, continuous wellness insights and personalized feedback.
- Additional Blueprint Demonstrations – Highlighting modular reuse, cross-domain scalability, and the seamless progression from validated hardware to adaptive, Agentic AI-driven intelligence.
Each demo illustrates how MosChip’s pre-validated blueprints minimize integration effort, enable compliance, and establish a foundation for continuous intelligence.
Leadership Comments
“We’re bringing a modular, integrated engineering model to product development – pre-validated, reconfigurable, and built on stackable design blocks,” said Vishal Patil, Senior Vice President – Product Engineering BU at MosChip. “By integrating leading hardware ecosystems with embedded software stacks, DigitalSky GenAIoT™ modules, and AgenticSky™ cores, we’re enabling OEMs to assemble and evolve next-generation products faster than ever.”
“Today, the real differentiator for OEMs is how quickly and reliably they can turn proven hardware ecosystems into adaptive, intelligent products,” said Sribash Dey, Senior Vice President – NA & Europe Sales at MosChip. “ProductXcelerate™ Blueprints enable that transformation – turning engineering concepts into agentic products that evolve with intelligence and speed, ready for the AI-led product era.”
