Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO, and PSOC that enables a quick start into automotive software development, is being introduced by Infineon Technologies. Under a three-month evaluation license, Drive Core offers pre-integrated software and tools from Infineon and other vendors that are ready for use.
For Embedded World 2025, Infineon releases the first five software bundles, which cover AURIX, TRAVEO T2G, and PSOC 4 HV. A three-month evaluation license is offered for them.
AURIX Drive Core AI: TC4x PPU model-based development
By integrating third-party tools and software components, the AURIX Drive Core AI bundle makes it possible for developers to effectively assess the TC4x Parallel Processing Unit (PPU), a high-performance computing platform designed to meet the demands of autonomous driving and e-mobility.
With MATLAB Simulink and the AURIX Hardware support package, the solution guarantees a quick and simple setup of the model-based design cycle.
The bundle includes ready-to-use Simulink examples, a thorough tutorial, and the necessary compiler tools, compute, and neural network libraries.
The bundle, which was created in partnership with Infineon’s ecosystem partners HighTec, MathWorks, and Synopsys, provides automotive engineers with strong simulation and design capabilities using the PPU.
AURIX Drive Core AUTOSAR: TC4x with Vector MICROSAR and Tasking compiler
The purpose of the AURIX Drive Core AUTOSAR software bundle is to simplify AUTOSAR-based projects for various safety applications, including zone controllers and ADAS. Among the embedded software components are Vector’s MICROSAR Classic, a pre-integrated real-time capable foundation software stack, and Infineon’s MCAL driver. For TC4x, Tasking offers their most recent certified development toolchain.
AURIX Drive Core for NeuSAR: TC4x with NeuSAR cCore from our development partner Neusoft Reach
Targeting the Chinese automotive market, the AURIX Drive Core NEUSAR bundle includes all the necessary hardware and software to create a complete AUTOSAR classic solution with TC4x.
NeuSAR cCore 4.0, an AUTOSAR software platform in accordance with R21-11, is included, along with a bootloader that is certified by ISO 21434 ASIL-D and a full-stack security solution.
HighTec’s C/C++ compiler tools and Infineon’s AUTOSAR MCAL drivers are already incorporated into the software platform. Developers can begin working on various example projects right away. Local criteria are covered in detail in both Chinese and English publications.
TRAVEO T2G Drive Core Graphics: Graphics Driver and QT graphics stack
Customers can test the TRAVEO T2G for cockpit applications using the TRAVEO T2G Drive Core Graphics kit. It is improved by superior graphics capabilities and Qt’s AUTOSAR ready for MCU graphics stack. It offers a hardware abstraction layer and graphics drivers from Infineon, an IAR compiler. In addition, the bundle contains the TRAVEO T2G, QT’s graphics, and Infineon’s MCAL.
PSOC 4 HV Drive Core Control: APDL with Vector OS
As the foundational software, Infineon presents a bundle with Vector’s MICROSAR IO product. For small mechatronic electronic control units used in automotive applications, MICROSAR IO is a basic layer that is efficient, safe, and lightweight. With an emphasis on cost effectiveness, reusability, and OEM independence, MICROSAR IO is designed for automotive subsystems like battery management, parking sensors, and HVAC systems. The bundle offers a resource-efficient solution, lowers the total system cost, and guarantees dependable operation in mission-critical domains when combined with Infineon’s PSOC 4 HV microcontroller.
Leadership Comments
“With the introduction of Drive Core, we are accelerating and simplifying our customers’ software development while reducing their commercial complexity in supplier management,” said Patrick Will, Senior Director at Infineon. “Drive Core offers a seamless user experience throughout the R&D journey by pre-integrating our partners’ and our own software components and toolchains, thereby minimizing migration efforts with a single click.”
Availability
The described first software bundles will be presented at embedded world 25 in Nuremberg from March 11 to 13.
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