In a strive to make electric mobility available to a wider market that requires affordability, excellent performance, and efficiency – Infineon Technologies launches the HybridPACK Drive G2 Fusion, creating a new traction inverter power module standard for the e-mobility industry.
The first plug-and-play power module that combines Infineon’s silicon and silicon carbide (SiC) technologies is the HybridPACK Drive G2 Fusion. This innovative approach offers more options for inverter optimization while striking the perfect balance between performance and cost effectiveness.
One of the primary distinctions between SiC and silicon in power modules is that SiC is more costly than silicon-based power modules due to its higher breakdown voltage, switching speed, and thermal conductivity. The novel module can cut the system cost while preserving vehicle performance and efficiency while reducing the SiC content per vehicle. For instance, system vendors can use just 30% SiC and 70% silicon area to achieve almost the same system efficiency as a full SiC solution.
With no complicated setups or adjustments needed, HybridPACK Drive G2 Fusion broadens Infineon’s line of HybridPACK Drive power modules and can be swiftly and simply incorporated into car modules or components.
In the 750 V class, the HybridPACK Drive G2 Fusion module has a maximum power output of 220 kW. It guarantees enhanced thermal conductivity and great reliability across the whole temperature range of -40 °C to +175 °C.
The usage of a single gate driver or two gate drivers is made possible by the special characteristics of Infineon’s CoolSiC technology and its silicon IGBT EDT3 technology, which have extremely quick turn-on. This makes switching from fully silicon or fully SiC-based inverters to fusion inverters simple.
Generally, Infineon’s comprehensive knowledge of SiC MOSFET and silicon IGBT technology, power module packaging, gate drivers, and sensors allows for high-end solutions with system-level cost benefits. For more accurate and effective motor control, the HybridPACK Drive package can incorporate Swoboda or XENSIV Hall sensors.
Key Comments
“Our new HybridPACK Drive G2 Fusion module underlines Infineon’s innovation leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, Senior Vice President & General Manager High Voltage at Infineon’s Automotive division. “Addressing the demand for greater e-mobility range, this technological breakthrough smartly combines silicon carbide and silicon. Integrated in a well-introduced module package footprint it offers compelling cost-performance ratio over pure silicon carbide modules without adding system complexity for automotive system suppliers and vehicle manufacturers.”
Infineon will showcase the new HybridPACK Drive G2 Fusion at electronica 2024 in Munich from November 12 to 15 (hall C3, booth 502).
