Renesas Electronics unveiled the RA4L1 microcontroller (MCU) family, which consists of 14 new devices with segment LCD compatibility, ultra-low power consumption, and sophisticated security features.
The new MCUs, which are based on an 80-MHz Arm Cortex M33 processor with TrustZone support, offer an unparalleled blend of performance, functionality, and power savings that let designers tackle a wide range of applications, such as smart locks, water meters, Internet of Things sensors, and more.
With all SRAM intact, the RA4L1 MCUs’ exclusive low-power technology provides 168 µA/MHz active mode at 80 MHz and a standby current of only 1.70 µA. In order to meet the demands of goods like digital cameras, smart labels, and portable printers, they are also offered in incredibly small sizes, such as a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP).
Key Features of the RA4L1 MCUs
- Core: 80 MHz Arm Cortex-M33 with TrustZone
- Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash
- Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
- Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100
- Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash
- Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option
The Flexible Software Package (FSP) from Renesas supports the RA4L1 MCUs. By offering all the infrastructure software required—including different RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support—as well as reference software to create intricate AI, motor control, and cloud solutions, the FSP facilitates quicker application development.
Customers can fully customize application development by integrating their own legacy code and preferred RTOS with FSP. Existing IP can be easily moved to and from RA6 or RA2 Series devices thanks to the FSP.
Leadership Comments
“Renesas’ RA2L1 Group MCUs have seen remarkable market success since their launch in 2020, addressing a diverse range of low-power applications requiring capacity touch. Built on the same low-power technology, the RA4L1 Group is our response to customers who require the unique combination of ultra-low power with better CPU performance, segment LCD support and advanced security,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas.
Availability
The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK). More information is available at renesas.com/RA4L1. Samples and kits can be ordered either on the Renesas website or through distributors.
